Personal tools
You are here: Home Organizers Program Committee
Document Actions

Program Committee

Program Chairs

Tom Drummond, University of Cambridge, UK
Hirokazu Kato, Osaka University, Japan
Mark A. Livingston, Naval Research Laboratory, USA

Area Chairs

Ron Azuma, HRL Laboratories, USA
Oliver Bimber, Bauhaus-University Weimar, Germany
Steve Feiner, Columbia University, USA
Hong Hua, University of Arizona, USA
Yoshinari Kameda, University of Tsukuba, Japan
Kiyoshi Kiyokawa, Osaka University, Japan
Gudrun Klinker, TU Munich, Germany
Vincent Lepetit, Swiss Federal Institute of Technology, Switzerland
Dirk Reiners, University of Louisiana, USA
Hideo Saito, Keio University, Japan
Dieter Schmalstieg, Graz University of Technology, Austria
Bruce Thomas, University of South Australia. Australia

International Program Committee Members

Daniel Aliaga, Purdue University, USA
Yoshihiro Ban, Kobe University, Japan
Istvan Barakonyi, Imagination GmbH, Austria
Gregory Baratoff, Siemens AG, Germany
Martin Bauer, TU Munchen, Germany
Steffi Beckhaus, University of Hamburg, Germany
Reinhold Behringer, Leeds Metropolitan University, UK
Marie-Odile Berger, INRIA Lorraine & LORIA, France
Rodney Berry, National University of Singapore, Singapore
Mark Billinghurst, HitLabNZ, NZ
Andreas Butz, University of Munich, Germany
Adrian Cheok, National University of Singapore, Singapore
Larry Davis, University of Central Florida, USA
Klaus Dorfmueller-Ulhaas, University of Augsburg, Germany
Steve Ellis, NASA Ames, USA
Miguel Encarnacao, Humana Inc, USA
Chris Esposito, Boeing, USA
Farzam Farbiz, Institute for Infocomm Research, Singapore
Mark Fiala, NRC Canada, Canada
Morten Fjeld, Chalmers University of Technology, Sweden
Matthew Franklin, Qinetiq, Ltd, UK
Henry Fuchs, University of North Carolina at Chapel Hill, USA
Christian Geiger, Fachhochschule Dusseldorf, Germany
Yakup Genc, Siemens, USA
Brian Goldiez, University of Central Florida, USA
Sinem Guven, IBM, USA
Michael Haller, Upper Austria University of Applied Sciences, Austria
Felix Hamza-Lup, Armstrong Atlantic State University, USA
Tobias Höllerer, University of California, Santa Barbara, USA
Masataka Imura, Nara Institute of Science and Technology, Japan
Paul Jackson, Boeing, USA
Simon Julier, University College London, UK
Masayuki Kanbara, Nara Institute of Science and Technology, Japan
Ali Khamene, Siemens Corporate Research, USA
Georg Klein, University of Oxford, UK
Mathias Kolsch, Naval Postgraduate School, USA
Takeshi Kurata, National Institute of Advanced Industrial Science and Technology, Japan
Tomohiro Kuroda, Osaka University, Japan
Joseph LaViola, Brown University, USA
Robert Lindeman, Worcester Polytechnic Institute, USA
Benjamin Lok, University of Florida, USA
Blair MacIntyre, Georgia Institute of Technology, USA
Fumihiko Maeda, NTT, Japan
David Mizell, Cray, USA
Stefan Mueller, U Koblenz, Germany
Leonid Naimark, InterSense, USA
Nassir Navab, TU Munich, Germany
Ulrich Neumann, USC, USA
Joe Newman, University of Cambridge, UK
Yuichi Ohta, University of Tsukuba, Japan
Leif Oppermann, University of Nottingham, UK
Charles Owen, Michigan State University, USA
Jarrell Pair, USC, USA
Wayne Piekarski, University of South Australia, Australia
Ivan Poupyrev, Sony CSL, Japan
Kari Pulli, Nokia Research Center Palo Alto, USA
Holger Regenbrecht, University of Otago, NZ
Gerhard Reitmayr, University of Cambridge, UK
Jannick Rolland, University of Central Florida, USA
Gerhard Roth, NRC Canada, Canada
Christian Sandor, Canon Inc., Japan
Yoichi Sato, University of Tokyo, Japan
Kiyohide Satoh, Canon Inc., Japan
Frank Sauer, Siemens Corporate Research, Inc., USA
Fumihisa Shibata, Ritsumeikan University, Japan
Gilles Simon, University of Nancy & LORIA, France
Andrei State, University of North Carolina at Chapel Hill, USA
Didier Stricker, Fraunhofer IGD, Germany
Wolfgang Stuerzlinger, York University, Canada
J. Edward Swan II, Mississippi State University, USA
Ryuhei Tenmoku, Ritsumeikan University, Japan
Mihran Tuceryan, Indiana Univ - Purdue Univ. Indianapolis, USA
Shinji Uchiyama, Canon Inc., Japan
Daniel Wagner, Graz University of Technology, Austria
Greg Welch, University of North Carolina at Chapel Hill, USA
Chad Wingrave, Virginia Tech, USA
Hiroyuki Yamamoto, Canon Inc., Japan
Naokazu Yokoya, Nara Institute of Science and Technology, Japan
Suya You, USC, USA


Powered by Plone, the Open Source Content Management System